slvda2.8lc 1 05143.r6 4/05 www .protekde vices.com ul tra low capacitance tvs arra y only one name means protektion? applications ? ethernet - 10/100/1000 base t ? cellular phone base stations ? switching stations ? audio/video inputs ? handheld devices iec compatibility (en61000-4) ? 61000-4-2 (esd): air - 15kv, contact - 8kv ? 61000-4-4 (eft): 40a - 5/50ns ? 61000-4-5 (surge): 24a, 8/20s - level 2(line-ground) & level 3(line-line) features ? 600 watts peak pulse power per line (tp = 8/20s) ? provides protection for four (4) line pairs ? ? ? ? ? low leakage current < 1.0a ? ? ? ? ? ultra low capacitance: 1.25pf ? rohs compliant in lead-free versions mechanical characteristics ? molded jedec so-8 ? weight 70 milligrams (approximate) ? available in tin-lead or lead-free pure-tin plating(annealed) ? solder reflow temperature: tin-lead - sn/pb, 85/15: 240-245c pure-tin - sn, 100: 260-270c ? flammability rating ul 94v-0 ? 12mm tape and reel per eia standard 481 ? device marking: marking code, logo, date code & pin one defined by dot on package 05143 pin configura tion so-8
2 www .protekde vices.com 05143.r6 4/05 sl vda2.8lc device characteristics maximum ratings @ 25c unless otherwise specified peak pulse power (t p = 8/20s) - see figure 1 peak pulse current (t p = 8/20s) lead soldering temperature operating temperature symbol value c c a watts units 260c (10 sec) 30 600 t j i pp p pp t stg parameter storage temperature t ii -55c to 150c -55c to 150c c electrical characteristics per line @ 25c unless otherwise specified part number device marking code rated stand-off voltage v wm volts minimum breakdown voltage @ 1ma v (br) volts minimum snap back voltage @ i sb = 50ma v sb volts slvda2.8lc l v2.8 2.8 3.0 2.8 4.6 typical capacitance @0v, 1mhz c pf 6.2 5 maximum clamping voltage (see fig. 2) @i p = 1a v c volts maximum clamping voltage (see fig. 2) @i p = 5a v c volts maximum clamping voltage (see fig. 42) @8/20s v c @ i pp maximum leakage current @v wm i d a 21.0v@30.0a 1.0 figure 2 pulse wave form figure 1 peak pulse power vs pulse time 0.01 1 10 100 1,000 10,000 t d - pulse duration - s 0 5 10 15 20 25 30 t - time - s 0 20 40 60 80 100 120 i pp - peak pulse current - % of i pp test waveform parameters t f = 8s t d = 20s t f peak value i pp e -t t d = t i pp /2 10 100 1,000 10,000 p pp - peak pulse current - watts 600w, 8/20s waveform
3 www .protekde vices.com 05143.r6 4/05 sl vda2.8lc graphs 0 25 50 75 100 125 150 t l - lead temperature - c 20 40 60 80 100 % of rated power peak pulse power 8/20s average power figure 3 power derating curve 0 figure 4 typical clamping voltage vs peak pulse current 0 5 10 15 20 25 30 i pp - peak pulse current a v c - clamping voltage - v 20 16 12 8 4 0
4 www .protekde vices.com 05143.r6 4/05 sl vda2.8lc application note circuit board la yout recommenda tions circuit board layout is critical for electromagnetic compatibility (emc) protection. the following guidelines are recommended: ? the protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. ? the path length between the tvs device and the protected line should be minimized. ? all conductive loops including power and ground loops should be minimized. ? the transient current return path to ground should be kept as short as possible to reduce parasitic inductance. ? ground planes should be used whenever possible. for multilayer pcbs, use ground vias. figure 1: bidirectional common-mode protection figure 2: bidirectional differential-mode protection electronic equipment is susceptible to damage caused by electrostatic discharge (esd), electrical fast transients (eft), and te rtiary lightning effects. knowing that equipment can be damaged, the slvda2.8lc was designed to provide the level of protection required to safe guard se nsitive high speed data circuits. this product can be used to provide a level of protection to meet bidirectional requirements either in a common-mode or differential-mode configuration. bidirectional common-mode configuration (figure 1) the slvda2.8lc can provide up to four (4) lines of protection in a common-mode configuration as depicted in figure 1. circuit connectivity is as follows: ? line 1 is connected to pin 8 ? line 2 is connected to pin 7 ? line 3 is connected to pin 6 ? line 4 is connected to pin 5 ? pins 1, 2, 3, and 4 are connected to ground bidirectional differential-mode configuration (figure 2) the slvda2.8lc can provide up to four line pairs (4) of protection in a differential-mode configuration as depicted in figure 2 . circuit connectivity is as follows: ? line pair # 1 is connected to pin 8 and 1 ? line pair # 2 is connected to pin 7 and 2 ? line pair # 3 is connected to pin 5 and 4 ? line pair # 4 is connected to pin 6 and 3
5 www .protekde vices.com 05143.r6 4/05 sl vda2.8lc package outline & dimensions outline & dimensions: rev 1 - 11/01, 06009 copyright ? prot ek devices 2005 specifications: protek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except jedec). design changes: protek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer?s and that in furnishing engineering and technical assistance, protek assumes no responsibility wit h respect to the selection or specifications of such products. protek devices 2929 south fair lane, tempe, az 85282 tel: 602-431-8101 fax: 602-431-2288 e-mail: sales@protekdevices.com web site: www.protekdevices.com tape & reel/bulk ordering nomenclature 1. surface mount product is taped and reeled in accordance with eia-481. 2. suffix-t7 = 7 inch reel - 1,000 pieces per 12mm tape, i.e., slvda2.8lc-t7. 3. suffix-t13 = 13 inch reel - 2,500 pieces per 12mm tape, i.e., slvda2.8lc-t13. 4. suffix - lf = lead-free pure-tin plating, i.e., slvda2.8lc-lf-t7. 5. no suffix = product shipped in tubes of 98 pcs per tube. a b c d f g j k p r 4.80 3.80 1.35 0.35 0.40 1.27 bsc 0.18 0.10 5.80 0.25 5.00 4.00 1.75 0.49 1.250 1.27 bsc 0.25 0.25 6.20 0.50 0.189 0.150 0.054 0.014 0.016 0.05 bsc 0.007 0.004 0.229 0.010 0.196 0.157 0.068 0.019 0.049 0.05 bsc 0.009 0.008 0.244 0.019 dim min max min max millimeters inches package dimensions notes 1. - t - = seating plane and datum surface. 2. dimensions ?a? and ?b? are datum. 3. dimensions ?a? and ?b? do not include mold protrusion. 4. maximum mold protrusion is 0.015? (0.380 mm) per side. 5. dimensioning and tolerances per ansi y14.5m, 1982. 6. dimensions are exclusive of mold flash and metal burrs.
package outline so-8 !" # mounting pad
|
